NXP Semiconductors, an innovator and supplier of Ultra-Wideband (UWB) solutions, and Rohde & Schwarz collaborate to demonstrate a test setup for UWB radar target simulation at the upcoming Mobile World Congress in Barcelona. The demonstration, being the first of its kind, verifies the unique performance of the NXP Trimension™ NCJ29D6A chipset including the enhanced radar algorithms. It is capable of generating UWB radar targets with a variable target distance down to a few centimeters, enabling maximum control and reproducibility of the simulated scenario.
Caption:
One key component of the UWB radar target simulation is the R&S SMW200A signal generator.
Ultra-Wideband (UWB) technology is experiencing steep growth in automotive, mobile, and IoT markets, based on its secure and precise ranging capabilities. The Digital Key, as defined by the Car Connectivity Consortium (CCC), leverages UWB for secure and convenient hands-free car access without compromises. The current-generation NXP Trimension UWB chipsets enable new UWB radar use cases, such as Child Presence Detection (CPD), kick-sensing for easy trunk access, intrusion or proximity detection, and much more.
These UWB radar applications benefit from advanced target simulation, able to solve technical challenges, like short-distance target simulation and large signal bandwidth, to mention just two. The key components are the R&S SMW200A signal generator, a R&S FSW26 spectrum analyzer, and R&S developed control software. The equipment used is available in UWB engineering laboratories today, hence reducing the initial capital investment. The demonstration is especially interesting for UWB chipset suppliers, module providers, Tier1s, and vehicle OEMs.
In order to support the automotive ecosystem in testing these new use cases, collaboration with key partners is especially important. Rohde & Schwarz and NXP Semiconductors have worked closely together to validate this test system. Jürgen Meyer, Vice President Automotive Market Segment at Rohde & Schwarz, remarked, “We greatly appreciate the close working relationship with the NXP Semiconductors teams around the world to realize this unique demonstration to provide the automotive industry with the test capabilities it needs to enable the next wave of UWB applications.”
An integral part of this demonstration setup is NXP’s Trimension™ NCJ29D6A, which is the first monolithic UWB chipset that combines secure ranging and short-range radar with an integrated MCU to enable use cases such as CPD, kick-sensing, and intrusion detection. “The demonstrator from Rohde & Schwarz allows our customers to validate their UWB radar systems and algorithms to shorten development cycles and optimize time-to-market,” said Michael Leitner, General Manager Secure Car Access, NXP Semiconductors. “This collaboration with Rohde & Schwarz is another milestone contributing to the success of UWB technology in the automotive market.”
The test setup will be shown at the Mobile World Congress in Barcelona, from March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80. For more information, visit: www.rohde-schwarz.com.
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Rohde & Schwarz
Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems, and Networks & Cybersecurity Divisions. For 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory, and government customers to attain technological and digital sovereignty. The privately owned, Munich-based company can act independently, long-term, and sustainably. Rohde & Schwarz generated net revenue of EUR 2.93 billion in the 2023/2024 fiscal year (July to June). On June 30, 2024, Rohde & Schwarz had around 14,400 employees worldwide.
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Rohde & Schwarz USA, Inc.
6821 Benjamin Franklin Dr, Columbia, MD 21046, USA
Loberg Dominique
Phone: +1-503-523-7951
Email: Dominique.Loberg@rsa.rohde-schwarz.com
